2023
Semiconductor Chuck Temperature and Process Control

OSENSA’s high-accuracy fiber optic temperature sensors are designed specifically to meet the demanding requirements of semiconductor process control applications. OSENSA offers fast-response custom OEM solutions for both contact and non-contact optical temperature sensing for dielectric and conductor etch applications. Fiber optic sensors are embedded into the electrostatic chuck in multiple zones to provide maximum control and thermal uniformity.
Ask us more about applying temperature sensing for semiconductor wafer processing applications requiring precise process control in high RF and plasma environments. For enhanced plasma chemical vapor deposition (EPCVD) processes, our sensors use non-contact geometries where the sensing material is embedded into the base of the electrostatic chuck, but with the optical fiber positioned remotely. This method maximizes response speed and eliminates stem conduction losses. It also makes e-chuck replacement and refurbishing simpler, avoiding the risk of broken fiber optic temperature probes.