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Semiconductor Chuck Temperature & Process Control

fiber optic temperature sensorsOSENSA’s high-accuracy fiber optic temperature sensors are designed specifically to meet the demanding requirements of semiconductor process control applications. OSENSA offers fast-response custom OEM solutions for both contact and non-contact optical temperature sensing for dielectric and conductor etch applications. Fiber optic sensors are embedded into the electrostatic chuck in multiple zones to provide maximum control and thermal uniformity.

Semiconductor Wafer Processing Applications

Many semiconductor wafer processing applications rely on fiber optic temperature sensors for precise process control in high RF (radio frequency) and plasma environments. In a typical processing application, a silicon wafer is placed onto an electrostatic chuck that is rapidly heated and cooled in a plasma environment. Fiber optic temperature sensors are embedded into the base of the electrostatic chuck and provide high-accuracy, fast response for tight process control. Each electrostatic chuck is divided into multiple zones, requiring multiple fiber optic temperature sensors to maximize temperature uniformity across the surface of the wafer. Semiconductor applications employing this type of arrangement are typically dielectric and conductor etch processes.

Enhanced Plasma Chemical Vapor Deposition (EPCVD) Processes

For enhanced plasma chemical vapor deposition (EPCVD) processes, a shower head reactor is used to disperse reactant gasses into the process chamber while intense RF energy is applied. In these applications, fiber optic temperature sensors are employed to control the shower head temperature as well as monitor sidewall temperatures to minimize deposition on internal chamber surfaces. OSENSA’s fiber optic temperature sensors were developed specifically to support a wide variety of leading-edge semiconductor processes. OSENSA’s fiber optic sensors are available in non-contact geometries where the sensing material is embedded into the base of the electrostatic chuck, but with the optical fiber positioned remotely. This method maximizes response speed and eliminates stem conduction losses. It also makes e-chuck replacement and refurbishing simpler, avoiding the risk of broken fiber optic temperature probes.